XFP 10G BIDI 10km
YXP96-B7310&YXP96-B3710
1
Quantity
Features
Applications
Standards
Description
Small Form Factor 10Gb/s (XFP) transceivers are compliant with the current XFP Multi-Source Agreement (MSA) Specification. They comply with 10-Gigabit Ethernet 10GBASE-LR/LW per IEEE 802.3ae and 10G Fibre Channel 1200-SM-LL-L. Digital diagnostics functions are available via a 2-wire serial interface, as specified in the XFP MSA.
Module Block Diagram
Absolute Maximum Ratings
Recommended Operating Environment
Electrical Characteristics
Notes:
1. Connected directly to TX data input pins. AC coupling from pins into laser driver IC.
2. LOS is an open collector output. Should be pulled up with 4.7kΩ – 10kΩ on the host board. Normal operation is logic 0; loss of signal is logic 1.
Optical Parameters
Notes:
1. The optical power is launched into 9/125µm SMF.
2. Measured with a PRBS 231-1 test pattern @10.3125Gbps.
3. Unfiltered, 20-80%. Measured with a PRBS 231-1 test pattern @10.3125Gbps.
4. Measured with a PRBS 231-1 test pattern @10.3125Gbps, ER=4dB, BER <10-12.
Timing Characteristics:
Digital Diagnostic Monitor Characteristics (DDM)
The following digital diagnostic characteristics are defined over the Recommended Operating Environment unless otherwise specified. It is compliant to SFF8077i with internal calibration mode. For external calibration mode please contact our sales stuff.
Digital Diagnostic Memory Map (Compliant with SFF-8077i)
The transceivers provide serial ID memory contents and diagnostic information about the present operating conditions by the 2-wire serial interface (SCL, SDA).
The diagnostic information with internal calibrationor external calibration all are implemented,including received power monitoring, transmitted power monitoring, bias current monitoring, supply voltage monitoring and temperature monitoring.
The digital diagnostic memory map specific data field defines as following (For further information, please refer to SFF-8077i).
Pin Definitions
Pin Descriptions
Notes:
1. Module circuit ground is isolated from module chassis ground within the module.
2. It must be pulled up with 4.7k-10k ohms on host board to a voltage between 3.15V and 3.6V.
3. A Reference Clock input is not required.
Recommended Interface Circuit
Recommended Host Board Power Supply Circuit
Recommended High-speed Interface Circuit
Mechanical Dimensions
Ordering information
References
1. 10 Gigabit Small Form Factor Pluggable Module (XFP) Multi-Source Agreement (MSA), Rev 4.5 – August 2005.
2. Telcordia GR-253-CORE Specifications.
3. “Diagnostic Monitoring Interface for Optical Transceivers” SFF-8077i.
4.IEEE802.3ae 2002.
Important Notice
Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by YOUTHTON before they become applicable to any particular order or contract. In accordance with the YOUTHTON policy of continuous improvement specifications may change without notice. The publication of information in this data sheet does not imply freedom from patent or other protective rights of YOUTHTON or others. Further details are available from any YOUTHTON sales representative.
Contact Information
SHENZHEN YOUTHTON TECHNOLOGY CO., LTD.
ADD: F4, JINMA BUILDING, JINMA INDUSTRIAL PARK, SHIHUAN ROAD NO.4, SHIYAN STREET, BAOAN DISTRICT, SHENZHEN, CHINA
EMAIL: info@youthton.com
- Supports 9.95Gb/s to 10.5Gb/s bit rates
- Uncooled 1270nm DFB Laser and PIN photo-detector for YXP96-B7310
- Uncooled 1330nm DFB Laser and PIN photo-detector for YXP96-B3710
- Up to 10km on 9/125µm SMF
- Simplex LC receptacle optical interface compliant
- Hot pluggable
- All-metal housing for superior EMI performance
- RoHS6 compliant (lead free)
- Power dissipation <2.5W
- No Reference Clock required
- Built-in digital diagnostic functions
- Operating case temperature:
Applications
- 10GBASE-LR/LW 10G Ethernet
- 1200-SM-LL-L 10G Fibre Channel
Standards
- Fully compliant to XFP MSA Rev.4.5
- Compatible with IEEE802.3ae 2002
Description
Small Form Factor 10Gb/s (XFP) transceivers are compliant with the current XFP Multi-Source Agreement (MSA) Specification. They comply with 10-Gigabit Ethernet 10GBASE-LR/LW per IEEE 802.3ae and 10G Fibre Channel 1200-SM-LL-L. Digital diagnostics functions are available via a 2-wire serial interface, as specified in the XFP MSA.
Module Block Diagram
Absolute Maximum Ratings
| Parameter | Symbol | Min. | Typical | Max. | Unit |
| Power Supply Voltage1 | VCC3 | 0 | 3.6 | V | |
| Power Supply Voltage2 | VCC5 | 0 | 6 | V | |
| Storage Temperature | Ts | -40 | +85 | °C | |
| Relative Humidity | RH | 0 | 85 | % | |
| RX Input Average Power | Pmax | - | 1.5 | dBm |
Recommended Operating Environment
| Parameter | Symbol | Min. | Typical | Max. | Unit |
| Power Supply Voltage1 | VCC3 | 3.13 | 3.3 | 3.46 | V |
| Power Supply Voltage2 | VCC5 | 4.75 | 5 | 5.25 | V |
| Module Total Power | P | 2.5 | W | ||
| Operating Case Temperature | TC | -5 | +70 | °C | |
| Data Rate | 9.9 | 10.5 | Gbps |
Electrical Characteristics
| Parameter | Symbol | Min. | Typical | Max. | Unit | Note |
| Transmitter Section | ||||||
| InputDifferentialImpedance | Rin | 90 | 100 | 110 | Ω | |
| DifferentialDataInputSwing | Vin PP | 120 | 820 | mV | 1 | |
| Transmit Disable Voltage | VD | VCC3 – 1.3 | VCC3 | V | ||
| Transmit Enable Voltage | VEN | Vee | Vee+ 0.8 | V | ||
| Receiver Section | ||||||
| DifferentialDataOutputSwing | VoutPP | 340 | 850 | mV | ||
| LOS Fault | Vlos fault | VCC3 – 0.5 | VCC_host | V | 2 | |
| LOS Normal | Vlos norm | Vee | Vee+0.5 | V | 2 | |
Notes:
1. Connected directly to TX data input pins. AC coupling from pins into laser driver IC.
2. LOS is an open collector output. Should be pulled up with 4.7kΩ – 10kΩ on the host board. Normal operation is logic 0; loss of signal is logic 1.
Optical Parameters
| Parameter | Symbol | Min. | Typical | Max. | Unit | Note |
| Transmitter Section | ||||||
| Centre Wavelength | λc | 1260 | 1270 | 1280 | nm | YXP96-B7310 |
| 1320 | 1330 | 1340 | YXP96-B3710 | |||
| Spectral Width (-20dB) | Δλ | 1 | nm | |||
| Side Mode Suppression Ratio | SMSR | 30 | dB | |||
| Average Optical Power (avg.) | Pout | -8.2 | 0.5 | dBm | 1 | |
| Laser Off Power | Poff | - | - | -30 | dBm | |
| Extinction Ratio | ER | 3.5 | - | - | dB | 2 |
| Relative Intensity Noise | RIN | - | - | -128 | dB/Hz | |
| Optical Rise/Fall Time | tr/tf | - | 50 | ps | 3 | |
| Optical Return Loss Tolerance | - | - | 12 | dB | ||
| Output Optical Eye | Compliant with IEEE802.3ae eye masks when filtered | 2 | ||||
| Receiver Section | ||||||
| Receiver Center Wavelength | λc | 1320 | 1330 | 1340 | nm | YXP96-B7310 |
| 1260 | 1270 | 1280 | YXP96-B3710 | |||
| Receiver Sensitivity in Average Power | Sen | -14.4 | -3 | dBm | 4 | |
| Los Assert | LOSA | -25 | - | - | dBm | |
| Los Dessert | LOSD | - | - | -16 | dBm | |
| Los Hysteresis | LOSH | 0.5 | - | 5 | dB | |
| Overload | Pin-max | - | - | -3 | dBm | 4 |
| Receiver Reflectance | - | - | -12 | dB | ||
| Receiver Power (damage) | - | - | 1.5 | dBm | ||
Notes:
1. The optical power is launched into 9/125µm SMF.
2. Measured with a PRBS 231-1 test pattern @10.3125Gbps.
3. Unfiltered, 20-80%. Measured with a PRBS 231-1 test pattern @10.3125Gbps.
4. Measured with a PRBS 231-1 test pattern @10.3125Gbps, ER=4dB, BER <10-12.
Timing Characteristics:
| Parameter | Symbol | Min. | Typical | Max. | Unit |
| TX_Disable Assert Time | t_off | 10 | us | ||
| TX_Disable Negate Time | t_on | 2 | ms | ||
| Time to Initialize | t_init | 300 | ms | ||
| P_Down/RST Assert Delay | P_Down/RST_on | 100 | us | ||
| P-Down Reset Time | t_reset | 10 | us | ||
| RX_LOS Assert Delay | t_loss_on | 100 | us | ||
| RX_LOS Negate Delay | t_loss_off | 100 | us | ||
| Clock Frequency | fSCL | 400 | kHz |
Digital Diagnostic Monitor Characteristics (DDM)
The following digital diagnostic characteristics are defined over the Recommended Operating Environment unless otherwise specified. It is compliant to SFF8077i with internal calibration mode. For external calibration mode please contact our sales stuff.
| Parameter | Symbol | Min. | Max. | Unit |
| Temperature Monitor Absolute Error | DMI_Temp | -3 | 3 | °C |
| Laser Power Monitor Absolute Error | DMI_TX | -3 | 3 | dB |
| RX Power Monitor Absolute Error | DMI_RX | -3 | 3 | dB |
| Supply Voltage Monitor Absolute Error | DMI_VCC | -3% | 3% | V |
| Bias Current Monitor Absolute Error | DMI_Ibias | -10% | 10% | mA |
Digital Diagnostic Memory Map (Compliant with SFF-8077i)
The transceivers provide serial ID memory contents and diagnostic information about the present operating conditions by the 2-wire serial interface (SCL, SDA).
The diagnostic information with internal calibrationor external calibration all are implemented,including received power monitoring, transmitted power monitoring, bias current monitoring, supply voltage monitoring and temperature monitoring.
The digital diagnostic memory map specific data field defines as following (For further information, please refer to SFF-8077i).
Pin Definitions
Pin Descriptions
| Pin | Logic | Symbol | Name/Description | Ref. |
| 1 | GND | Module Ground | 1 | |
| 2 | VEE5 | Optional –5.2V Power Supply – Not required | ||
| 3 | LVTTL-I | Mod-Desel | Module De-select; When held low allows the module to , respond to 2-wire serial interface commands | |
| 4 | LVTTL-O |  Interrupt | Interrupt (bar); Indicates presence of an important condition which can be read over the serial 2-wire interface | 2 |
| 5 | LVTTL-I | TX_DIS | Transmitter Disable; Transmitter laser source turned off | |
| 6 | VCC5 | +5V Power Supply | ||
| 7 | GND | Module Ground | 1 | |
| 8 | VCC3 | +3.3V Power Supply | ||
| 9 | VCC3 | +3.3V Power Supply | ||
| 10 | LVTTL-I | SCL | Serial 2-Wire Interface Clock | 2 |
| 11 | LVTTL- I/O | SDA | Serial 2-Wire Interface Data Line | 2 |
| 12 | LVTTL-O | Mod_Abs | Module Absent; Indicates Module is not present. Grounded in the Module. | 2 |
| 13 | LVTTL-O | Mod_NR | Module Not Ready; | 2 |
| 14 | LVTTL-O | RX_LOS | Receiver Loss of Signal Indicator | 2 |
| 15 | GND | Module Ground | 1 | |
| 16 | GND | Module Ground | 1 | |
| 17 | CML-O | RD- | Receiver Inverted Data Output | |
| 18 | CML-O | RD+ | Receiver Non-Inverted Data Output | |
| 19 | GND | Module Ground | 1 | |
| 20 | VCC2 | +1.8V Power Supply – Not required | ||
| 21 | LVTTL-I | P_Down/RST | Power Down; When high, places the module in the low power stand-by mode and on the falling edge of P_Down initiates a module reset | |
| Reset; The falling edge initiates a complete reset of the module including the 2-wire serial interface, equivalent to a power cycle. | ||||
| 22 | VCC2 | +1.8V Power Supply – Not required | ||
| 23 | GND | Module Ground | 1 | |
| 24 | PECL-I | RefCLK+ | Reference Clock Non-Inverted Input, AC coupled on the host board – Not required | 3 |
| 25 | PECL-I | RefCLK- | Reference Clock Inverted Input, AC coupled on the host board – Not required | 3 |
| 26 | GND | Module Ground | 1 | |
| 27 | GND | Module Ground | 1 | |
| 28 | CML-I | TD- | Transmitter Inverted Data Input | |
| 29 | CML-I | TD+ | Transmitter Non-Inverted Data Input | |
| 30 | GND | Module Ground | 1 |
Notes:
1. Module circuit ground is isolated from module chassis ground within the module.
2. It must be pulled up with 4.7k-10k ohms on host board to a voltage between 3.15V and 3.6V.
3. A Reference Clock input is not required.
Recommended Interface Circuit
Recommended Host Board Power Supply Circuit
Recommended High-speed Interface Circuit
Mechanical Dimensions
Ordering information
| Part Number | Product Description |
| YXP96-B7310 | TX1270nm, RX1330nm, 10Gbps, 10km, Bi-Directional Simplex LC XFP Transceiver, -5ºC ~ +70ºC, With DDM. |
| YXP96-B3710 | TX1330nm, RX1270nm, 10Gbps, 10km, Bi-Directional Simplex LC XFP Transceiver, -5ºC ~ +70ºC, With DDM. |
References
1. 10 Gigabit Small Form Factor Pluggable Module (XFP) Multi-Source Agreement (MSA), Rev 4.5 – August 2005.
2. Telcordia GR-253-CORE Specifications.
3. “Diagnostic Monitoring Interface for Optical Transceivers” SFF-8077i.
4.IEEE802.3ae 2002.
Important Notice
Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by YOUTHTON before they become applicable to any particular order or contract. In accordance with the YOUTHTON policy of continuous improvement specifications may change without notice. The publication of information in this data sheet does not imply freedom from patent or other protective rights of YOUTHTON or others. Further details are available from any YOUTHTON sales representative.
Contact Information
SHENZHEN YOUTHTON TECHNOLOGY CO., LTD.
ADD: F4, JINMA BUILDING, JINMA INDUSTRIAL PARK, SHIHUAN ROAD NO.4, SHIYAN STREET, BAOAN DISTRICT, SHENZHEN, CHINA
EMAIL: info@youthton.com