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TRUMPF Photonic Components plans 56G VCSEL and photodiode demo at ECOC 2021

Date: 2021-09-02
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TRUMPF Photonic Components, part of the TRUMPF Group, says it plans to demonstrate its 56-Gbps VCSEL and photodiode functioning as a link supported by a transimpedance amplifier (TIA) and VCSEL driver at ECOC 2021 in Bordeaux, France.

TRUMPF Photonic Components plans 56G VCSEL and photodiode demo at ECOC 2021

The company says its VCSELs and photodiodes have been developed for extended temperature performance based on an upgraded manufacturing platform with enhanced process control and improved yields. The VCSELs feature fully passivated die and additional mechanical protection for the mesa for enhanced reliability. The companion photodiode features low dark current and additional ground pad for better shielding as well as ground-signal or signal-ground options for mounting. The combined feature set offers reduced cost for data center and high-performance computing applications, both from the reduced energy cost from less cooling as well as a reduction in device-related failures in the field.


“With our strong heritage in VCSEL and photodiode technology, we are continuously working to push the boundaries of what is possible,” commented Ralph Gudde vice president of marketing and sales. “While we are pleased to offer expanded temperature range on our devices up to 56 Gbps today, we are now focusing on bringing our 112-Gbps solutions to the market early next year, with first samples targeted for December 2021.”


The 56-Gbps VCSEL and photodiode demonstration at ECOC will take place in Booth 501.



Original link:

https://www.lightwaveonline.com/optical-tech/components/article/14209368/trumpf-photonic-components-plans-56g-vcsel-and-photodiode-demo-at-ecoc-2021

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